Sweet. I’ve been waiting for CAMM to gain momentum for a while now. Now all that needs to happen is for it to actually be used by OEMs.
Nothing obvious about it’s improvements… What’s novel? Looks like some onboard processing elements?
Basically, the way DIMMs are built with edge connectors causes trouble with signal integrity. That limits the maximum speed and is one reason why LPDDR is soldered.
CAMMs replace the edge connector with a grid of contacts like on modern CPUs. That’s easier on the signal, allowing for faster speeds and even LPDDR on modules. Downside: They need to lie flat on the mainboard and thus use more space. Then again, laptop RAM is typically mounted in a flat configuration already so it’s mostly a new challenge on the desktop.
In case you’re wondering why they announced CAMM2 and where CAMM1 went: The original CAMM was a proprietary module from Dell; their spec was refined into the JEDEC-standardized CAMM2.
Ah, I did note the grounding bad around the edge but hadn’t thought about where the actual contacts were. Ironic, considering I deal with high speed signaling professionally lol.
Thanks for the info, let’s see where the industry goes…
The main novel thing is non-soldered ram that’s fast. The huge improvement is upgradability in new laptops.
For sure, was quite annoyed to find my work laptop was soldered to 32Gb. Thanks.
All the cool kids have 96GB these days
